As a tradition, Holtop exhibited in China refrigeration 2013 from April 8th to 10th, in Shanghai. Our booth was located in W3H01 with area up to 100m2, which was among the booths of some big AC manufacturers such as Daikin, Midea, Tica, etc. showing our strength in the field of fresh air ventilation.
During the exhibition, Holtop presented its edged technologies.
1. Automatically clean device for rotary heat exchanger
It’s specially designed for some applications with macro fiber, large particles or stickum contained in the air. As the dirt collected in the heat exchanger, the efficiency will reduce, or the rotor even blocked. Regular cleaning is a must for proper operation, and the automatically clean device solve the trouble of daily maintenance, greatly saving running and maintaining costs. This technology was successfully applied in Mercedes-Benz’s factory project.
2. Plate fin E.R. paper and plastic total heat exchanger
Our new total heat exchanger is made of both E.R. paper and plastic fin. The plastic fins are corrugated for support in the heat exchanger, with stronger shape, higher strength, better pressure resistance and longer service life (up to 10-15 years).
3. Super slim energy recovery ventilator
The most shining new star in the booth was the newly launched Miss Slim energy recovery ventilator. The industry’s slimmest figure capture eyes of professional designers, engineers and real estate investors, which highlighted our world class design quality.
Besides, our plate heat exchanger with various specifications, giant rotary heat exchanger, heat recovery air handling unit, high efficiency heat recovery ventilator, and other energy recovery ventilators are also exhibited.
We have entertained many visitors from home and aboard, and discussed business with them. Through this exhibition, we have received much market information, and built up more reliable and friendly relationship with our customers.
We hereby thank all visitors, and we will continuously attend more international expos to present our edged technologies
Post time: Apr-20-2013
